Please note: This is an on-site role 100% of the time.
Laptop will be issued for this role.

• The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

 Skill sets required not limited to the following 

• Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred.
• Knowledge of packaging material property and behavior is beneficial.
• Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized
• Minimum educational qualification is an AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
• Must be able to stand and work for at least 6 hours.