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Job Details

Job Title
: Failure analysis Technician
Required Skills
: imaging, Optical Microscopy, PCB, polishing, SEM, X-section
: 12

Job Description

Job Title Failure analysis Technician
Duration Up to 18 months with possible Extension
Location Chandler AZ 85226

Job Description

  • The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
  • Knowledge of packaging material property and behavior is beneficial.
  • Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized

Preferred skills

  • Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, Labview and SEM imaging on printed circuit board are preferred.
  • Minimum Educational Requirement: BS degree or higher in science or engineering and 8+ years’ experience in failure analysis, material analysis, process development or analytical tool development.

Required Details

: 2+
Travel Required
: No
Clearance Required
: No

Contact Details

Contact person
: Sathya Narayana
: 678-203-2471

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