Job Description

• The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
• Knowledge of packaging material property and behavior is beneficial.
• Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized

Preferred skills

• Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, Labview and SEM imaging on printed circuit board are preferred.
• Minimum Educational Requirement: BS degree or higher in science or engineering and 8+ years’ experience in failure analysis, material analysis, process development or analytical tool development.